Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints
DC Field | Value | Language |
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dc.contributor.author | Seo, Wonil | - |
dc.contributor.author | Kim, Kyoung-Ho | - |
dc.contributor.author | Kim, Young-Ho | - |
dc.contributor.author | Yoo, Sehoon | - |
dc.date.accessioned | 2021-08-02T13:53:50Z | - |
dc.date.available | 2021-08-02T13:53:50Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2018-01 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/17862 | - |
dc.description.abstract | The growth of interfacial intermetallic compound and the brittle fracture behavior of Sn-3.0Ag-0.5-Cu solder (SAC305) joints on electroless nickel immersion gold (ENIG) surface finish have been investigated using Ni-P plating solution at temperatures from 75A degrees C to 85A degrees C and fixed pH of 4.5. SAC305 solder balls with diameter of 450 mu m were mounted on the prepared ENIG-finished Cu pads and reflowed with peak temperature of 250A degrees C. The interfacial intermetallic compound (IMC) thickness after reflow decreased with increasing Ni-P plating temperature. After 800 h of thermal aging, the IMC thickness of the sample prepared at 85A degrees C was higher than for that prepared at 75A degrees C. Scanning electron microscopy of the Ni-P surface after removal of the Au layer revealed a nodular structure on the Ni-P surface. The nodule size of the Ni-P decreased with increasing Ni-P plating temperature. The Cu content near the IMC layer increased to 0.6 wt.%, higher than the original Cu content of 0.5 wt.%, indicating that Cu diffused from the Cu pad to the solder ball through the Ni-P layer at a rate depending on the nodule size. The sample prepared at 75A degrees C with thicker interfacial IMC showed greater high-speed shear strength than the sample prepared at 85A degrees C. Brittle fracture increased with decreasing Ni-P plating temperature. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | SPRINGER | - |
dc.title | Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Young-Ho | - |
dc.identifier.doi | 10.1007/s11664-017-5821-1 | - |
dc.identifier.scopusid | 2-s2.0-85030544459 | - |
dc.identifier.wosid | 000418580800012 | - |
dc.identifier.bibliographicCitation | JOURNAL OF ELECTRONIC MATERIALS, v.47, no.1, pp.110 - 116 | - |
dc.relation.isPartOf | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.citation.title | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.citation.volume | 47 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 110 | - |
dc.citation.endPage | 116 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | Y | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | PHOSPHORUS | - |
dc.subject.keywordPlus | METALLIZATION | - |
dc.subject.keywordPlus | SOLDERABILITY | - |
dc.subject.keywordPlus | PARAMETERS | - |
dc.subject.keywordPlus | MORPHOLOGY | - |
dc.subject.keywordPlus | DEPOSITS | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | ALLOY | - |
dc.subject.keywordPlus | NI(P) | - |
dc.subject.keywordAuthor | Electroless nickel immersion gold | - |
dc.subject.keywordAuthor | Sn-3.0Ag-0.5Cu | - |
dc.subject.keywordAuthor | Ni-P | - |
dc.subject.keywordAuthor | plating temperature | - |
dc.subject.keywordAuthor | interfacial intermetallic compound | - |
dc.subject.keywordAuthor | brittle fracture | - |
dc.subject.keywordAuthor | high-speed shear strength | - |
dc.identifier.url | https://link.springer.com/article/10.1007/s11664-017-5821-1 | - |
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