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Patterning aluminum thin films by water-mediated nano-transfer printing
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Byoung H. | - |
| dc.contributor.author | Sung, Myung M. | - |
| dc.contributor.author | Kim, Sang H. | - |
| dc.contributor.author | Lee, Ki-Dong | - |
| dc.date.accessioned | 2022-12-21T05:12:58Z | - |
| dc.date.available | 2022-12-21T05:12:58Z | - |
| dc.date.issued | 2007-12 | - |
| dc.identifier.issn | 0374-4884 | - |
| dc.identifier.issn | 1976-8524 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/179254 | - |
| dc.description.abstract | We report a new nano-transfer printing (nTP) method that uses a water-mediated transfer process. Water-mediated nTP is based on the direct transfer of a metal thin film from a stamp to a substrate via water-mediated surface bonding between the stamp and the substrate. This procedure can generate aluminum (Al) patterns with micrometer and nanometer-scale feature sizes. Furthermore, an array of Al nanochannels is fabricated by using this method. The transferred Al patterns chemically bound to the substrate surface and thus exhibit strong adhesion. | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | 한국물리학회 | - |
| dc.title | Patterning aluminum thin films by water-mediated nano-transfer printing | - |
| dc.type | Article | - |
| dc.publisher.location | 대한민국 | - |
| dc.identifier.doi | 10.3938/jkps.51.203 | - |
| dc.identifier.wosid | 000252143900005 | - |
| dc.identifier.bibliographicCitation | Journal of the Korean Physical Society, v.51, pp S203 - S206 | - |
| dc.citation.title | Journal of the Korean Physical Society | - |
| dc.citation.volume | 51 | - |
| dc.citation.startPage | S203 | - |
| dc.citation.endPage | S206 | - |
| dc.type.docType | Article; Proceedings Paper | - |
| dc.identifier.kciid | ART001227706 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Physics, Multidisciplinary | - |
| dc.subject.keywordPlus | DEPOSITION | - |
| dc.subject.keywordPlus | SURFACES | - |
| dc.subject.keywordPlus | CHEMISTRIES | - |
| dc.subject.keywordPlus | MONOLAYERS | - |
| dc.subject.keywordPlus | BRIDGES | - |
| dc.subject.keywordPlus | SILICON | - |
| dc.subject.keywordPlus | STAMP | - |
| dc.subject.keywordPlus | MEMS | - |
| dc.subject.keywordAuthor | Al metal patterning | - |
| dc.subject.keywordAuthor | soft lithography | - |
| dc.subject.keywordAuthor | solid bridge | - |
| dc.subject.keywordAuthor | liquid bridge | - |
| dc.identifier.url | https://www.jkps.or.kr/journal/view.html?doi=10.3938/jkps.51.203 | - |
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