Cited 0 time in
Atomic investigation of Fe-Cu magnetic thin films by molecular dynamics simulation
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon Gun | - |
| dc.contributor.author | Chung, Yong Chae | - |
| dc.date.accessioned | 2022-12-21T06:36:19Z | - |
| dc.date.available | 2022-12-21T06:36:19Z | - |
| dc.date.issued | 2007-09 | - |
| dc.identifier.issn | 0021-4922 | - |
| dc.identifier.issn | 1347-4065 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/179645 | - |
| dc.description.abstract | The deposition behavior of an Fe-Cu magnetic metallic multilayer system was investigated at the atomic level using molecular dynamics simulation. It was found that a mixture confined to a single atomic layer at the Cu(001) surface was formed at room temperature. The Fc-Cu system shows mixing characteristics such as layer coverage function and mixing length, that are significantly different from those of the Fe-Al metallic system. The different intermixing behavior could be successfully explained in terms of cohesive energy and atomic size mismatch. | - |
| dc.format.extent | 3 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | IOP Publishing Ltd | - |
| dc.title | Atomic investigation of Fe-Cu magnetic thin films by molecular dynamics simulation | - |
| dc.type | Article | - |
| dc.publisher.location | 영국 | - |
| dc.identifier.doi | 10.1143/JJAP.46.6309 | - |
| dc.identifier.scopusid | 2-s2.0-34648836100 | - |
| dc.identifier.wosid | 000250066700044 | - |
| dc.identifier.bibliographicCitation | Japanese Journal of Applied Physics, v.46, no.9B, pp 6309 - 6311 | - |
| dc.citation.title | Japanese Journal of Applied Physics | - |
| dc.citation.volume | 46 | - |
| dc.citation.number | 9B | - |
| dc.citation.startPage | 6309 | - |
| dc.citation.endPage | 6311 | - |
| dc.type.docType | Article; Proceedings Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | ALLOY FORMATION | - |
| dc.subject.keywordPlus | AL | - |
| dc.subject.keywordPlus | ANTIFERROMAGNETISM | - |
| dc.subject.keywordPlus | INTERFACE | - |
| dc.subject.keywordPlus | SURFACE | - |
| dc.subject.keywordPlus | GROWTH | - |
| dc.subject.keywordPlus | CO | - |
| dc.subject.keywordAuthor | molecular dynamics simulation | - |
| dc.subject.keywordAuthor | interfacial structure | - |
| dc.subject.keywordAuthor | Fe/Cu multilayer system | - |
| dc.subject.keywordAuthor | thin-film growth | - |
| dc.identifier.url | https://iopscience.iop.org/article/10.1143/JJAP.46.6309 | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1366
COPYRIGHT © 2024 HANYANG UNIVERSITY.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.
