Iodine-catalyzed chemical vapor deposition of Cu on MPTMS monolayer surface in a low deposition temperature regime
DC Field | Value | Language |
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dc.contributor.author | Park, Hae Jin | - |
dc.contributor.author | Shin, Hyunjung | - |
dc.contributor.author | Jung, Hyun Suk | - |
dc.contributor.author | Kim, C | - |
dc.contributor.author | Sung, Myung Mo | - |
dc.contributor.author | Lee, CM | - |
dc.contributor.author | Soh, Hoe Sup | - |
dc.contributor.author | Lee, Jaegab | - |
dc.date.accessioned | 2022-12-21T06:42:07Z | - |
dc.date.available | 2022-12-21T06:42:07Z | - |
dc.date.created | 2022-08-26 | - |
dc.date.issued | 2007-09 | - |
dc.identifier.issn | 0257-8972 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/179675 | - |
dc.description.abstract | Cu was deposited on a self-assembled monolayer of a 3-mercaptopropyltrimethoxysilane (MPTMS)-coated glass substrate by chemical vapor deposition (CVD) at temperatures <= 160 degrees C using (hfac)Cu(DMB) as a precursor. During deposition, there was an induction period for the Cu metal to nucleate on the MPTMS monolayer. This was attributed to the low mobility of Cu on the MPTMS, surface in the low temperature regime as a result of an interfacial interaction between Cut and S. The addition of iodine significantly shortened the induction period, which was attributed to the iodine-aided surface diffusion of Cu. In addition, the iodine addition increased the growth rate, and improved the (111) texture. Moreover, the adsorbed iodine atoms had surfactant effects on promoting lateral growth. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.title | Iodine-catalyzed chemical vapor deposition of Cu on MPTMS monolayer surface in a low deposition temperature regime | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Sung, Myung Mo | - |
dc.identifier.doi | 10.1016/j.surfcoat.2007.04.122 | - |
dc.identifier.scopusid | 2-s2.0-34547824631 | - |
dc.identifier.wosid | 000249340400121 | - |
dc.identifier.bibliographicCitation | SURFACE & COATINGS TECHNOLOGY, v.201, no.22-23, pp.9432 - 9436 | - |
dc.relation.isPartOf | SURFACE & COATINGS TECHNOLOGY | - |
dc.citation.title | SURFACE & COATINGS TECHNOLOGY | - |
dc.citation.volume | 201 | - |
dc.citation.number | 22-23 | - |
dc.citation.startPage | 9432 | - |
dc.citation.endPage | 9436 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | DIFFUSION-BARRIERS | - |
dc.subject.keywordPlus | COPPER-FILMS | - |
dc.subject.keywordPlus | METALLIZATION | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | CVD | - |
dc.subject.keywordAuthor | CVD | - |
dc.subject.keywordAuthor | copper | - |
dc.subject.keywordAuthor | SAMs | - |
dc.subject.keywordAuthor | iodine | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0257897207004999?via%3Dihub | - |
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