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Preparation and thermo-mechanical properties of 4-component polyimide films
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 서관식 | - |
| dc.contributor.author | 설경일 | - |
| dc.contributor.author | 김용석 | - |
| dc.contributor.author | 서동학 | - |
| dc.contributor.author | 최길영 | - |
| dc.contributor.author | 원종찬 | - |
| dc.date.accessioned | 2022-12-21T08:58:56Z | - |
| dc.date.available | 2022-12-21T08:58:56Z | - |
| dc.date.issued | 2007-03 | - |
| dc.identifier.issn | 0379-153X | - |
| dc.identifier.issn | 2234-8077 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180371 | - |
| dc.description.abstract | To enhance the thermo-mechanical properties of polyimide films which have potential application for the FCCL, we have synthesized the poly(amic acid)s composed of 4-components PMDA/BTDA and PDA/ODA as monomer system, and then they were effectively converted into 4-component polyimide films by thermal imidization process. It has been found that CTE values in the range of 100 similar to 200 degrees C dcreased with the amount of PDA, which also caused 36% and 59% increases in tensile modulus and strength respectively. And also. peel test results on 3-layered copper clad laminate using 4-component polyimide films showed excellent adhesion strength above 1.8 kgf/cm. On the basis of obtained results it can be concluded that 4-component polyimide films may be applied for the high performance FCCL base films. | - |
| dc.format.extent | 6 | - |
| dc.language | 한국어 | - |
| dc.language.iso | KOR | - |
| dc.publisher | 한국고분자학회 | - |
| dc.title | Preparation and thermo-mechanical properties of 4-component polyimide films | - |
| dc.type | Article | - |
| dc.publisher.location | 대한민국 | - |
| dc.identifier.scopusid | 2-s2.0-44649189967 | - |
| dc.identifier.wosid | 000245569100007 | - |
| dc.identifier.bibliographicCitation | Polymer(Korea), v.31, no.2, pp 130 - 135 | - |
| dc.citation.title | Polymer(Korea) | - |
| dc.citation.volume | 31 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 130 | - |
| dc.citation.endPage | 135 | - |
| dc.type.docType | Article | - |
| dc.identifier.kciid | ART001044088 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.relation.journalResearchArea | Polymer Science | - |
| dc.relation.journalWebOfScienceCategory | Polymer Science | - |
| dc.subject.keywordPlus | COPPER | - |
| dc.subject.keywordAuthor | polyimide | - |
| dc.subject.keywordAuthor | CTE | - |
| dc.subject.keywordAuthor | 4-component PI | - |
| dc.subject.keywordAuthor | 3-layered FCCL | - |
| dc.subject.keywordAuthor | adhesion | - |
| dc.identifier.url | http://www.polymer-korea.or.kr/journal/archive/reference_view/2620 | - |
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