Characteristics of the interfacial microstructure of chip-on-plastic joints under thermal cycling and aging treatment
DC Field | Value | Language |
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dc.contributor.author | Chen, Zhi Gang | - |
dc.contributor.author | Kim, Young Ho | - |
dc.date.accessioned | 2022-12-21T09:34:34Z | - |
dc.date.available | 2022-12-21T09:34:34Z | - |
dc.date.created | 2022-08-26 | - |
dc.date.issued | 2007-01 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180585 | - |
dc.description.abstract | This study presents the change of contact resistance and microstructure evolution of chip-on-plastic (COP) joints during the thermal cycling (T/C) test and aging treatment. Results showed that the average contact resistance of COP joints decreased in the early stage of the T/C test as well as during aging treatment. It was observed that after 1,000 h of aging, the (Cu, Au)(3)Sn phase was completely consumed and transformed into (Cu, Au)(6)Sn-5. The dependence of the growth of interfacial intermetallic compounds (IMCs) on the time of T/C and aging was investigated. The IMC growth had parabolic kinetics with time. The time exponent n under the condition of T/C was approximately 0.5, which indicated that the IMC growth was diffusion controlled. However, the fitting results on the aging treatment showed that n was only about 0.37. The reason for this finding is considered to be due to the fact that after 250 h, the Cu in some areas was depleted; thus, the diffusion in these areas was restrained. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | SPRINGER | - |
dc.title | Characteristics of the interfacial microstructure of chip-on-plastic joints under thermal cycling and aging treatment | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Young Ho | - |
dc.identifier.doi | 10.1007/s11664-006-0022-3 | - |
dc.identifier.scopusid | 2-s2.0-33947526383 | - |
dc.identifier.wosid | 000244464400007 | - |
dc.identifier.bibliographicCitation | JOURNAL OF ELECTRONIC MATERIALS, v.36, no.1, pp.45 - 55 | - |
dc.relation.isPartOf | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.citation.title | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.citation.volume | 36 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 45 | - |
dc.citation.endPage | 55 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | INTERMETALLIC COMPOUNDS | - |
dc.subject.keywordPlus | SOLDER JOINTS | - |
dc.subject.keywordPlus | CU | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | STRENGTH | - |
dc.subject.keywordAuthor | flip chip | - |
dc.subject.keywordAuthor | nonconductive adhesives (NCAs) | - |
dc.subject.keywordAuthor | thermal cycling (T/C) | - |
dc.subject.keywordAuthor | aging | - |
dc.subject.keywordAuthor | intermetallic compounds (IMCs) | - |
dc.identifier.url | https://link.springer.com/article/10.1007/s11664-006-0022-3 | - |
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