Chip-on-glass bonding using sn bump and non-conductive adhesive for LCD application

Abstract

We developed a new chip-on-glass (COG) bonding method using non-conductive adhesive (NCA) and Sn bumps. The bonding was performed with various electrode pads on the glass substrate at 150 degrees C for 150 s under 100 MPa. The initial average contact resistance was 5.7m Omega for Au pad, 19.6m Omega for indium-tin oxide (ITO)/Au pad, 11.2m Omega for Al pad respectively. Thermal cycling test was performed in the temperature range between 0 degrees C and 100 degrees C. The contact resistance of the Sn bump-Au pad joints did not change even after 1000 cycles. In contrast, the joints formed on other type of pads failed electrically between 300 and 500 cycles.