Evaluation of conductivity in W-Cu composites through the estimation of topological microstructures
DC Field | Value | Language |
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dc.contributor.author | Lee, Young Jung | - |
dc.contributor.author | Lee, Byung-Hoon | - |
dc.contributor.author | Kim, Gil-Su | - |
dc.contributor.author | Kim, Dae-Gun | - |
dc.contributor.author | Kim, Deok-Soo | - |
dc.contributor.author | Kim, Young Do | - |
dc.date.accessioned | 2022-12-21T10:54:17Z | - |
dc.date.available | 2022-12-21T10:54:17Z | - |
dc.date.created | 2022-09-16 | - |
dc.date.issued | 2006-07 | - |
dc.identifier.issn | 0167-577X | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/181226 | - |
dc.description.abstract | Conductivities of composites composed of various W-W contiguities were predicted in simulated microstructures. The relative conductivities and L-Cu ratios in the simulated microstructures were calculated using a Voronoi diagram. As the W-W contiguity increased, the conductivity underwent a two-stage change, as a result of the change in the L-Cu ratio (the ratio of the Cu length to the total length of the electron conduction path) of the total conduction path with lowest resistivity. This indicated that the W-W contiguity, which resulted from the homogeneity of sintered microstructures, affected the electrical and thermal conductivities of the W-Cu composite materials. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.title | Evaluation of conductivity in W-Cu composites through the estimation of topological microstructures | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Lee, Byung-Hoon | - |
dc.contributor.affiliatedAuthor | Kim, Deok-Soo | - |
dc.contributor.affiliatedAuthor | Kim, Young Do | - |
dc.identifier.doi | 10.1016/j.matlet.2005.12.113 | - |
dc.identifier.scopusid | 2-s2.0-33646161919 | - |
dc.identifier.wosid | 000237756600015 | - |
dc.identifier.bibliographicCitation | MATERIALS LETTERS, v.60, no.16, pp.2000 - 2003 | - |
dc.relation.isPartOf | MATERIALS LETTERS | - |
dc.citation.title | MATERIALS LETTERS | - |
dc.citation.volume | 60 | - |
dc.citation.number | 16 | - |
dc.citation.startPage | 2000 | - |
dc.citation.endPage | 2003 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | THERMAL-CONDUCTIVITY | - |
dc.subject.keywordPlus | VORONOI DIAGRAM | - |
dc.subject.keywordPlus | CIRCLE SET | - |
dc.subject.keywordPlus | POINT SET | - |
dc.subject.keywordPlus | MODEL | - |
dc.subject.keywordAuthor | W-Cu | - |
dc.subject.keywordAuthor | W-W contiguity | - |
dc.subject.keywordAuthor | conductivity | - |
dc.subject.keywordAuthor | Voronoi diagram | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0167577X05013212?via%3Dihub | - |
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