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Dependence of non-Prestonian behavior of ceria slurry with anionic surfactant on abrasive concentration and size in shallow trench isolation chemical mechanical polishing

Authors
Kang, Hyun-GooKim, Dae-HyeongKatoh, TakeoKim, Sung-JunPaik, UngyuPark, Jea-Gun
Issue Date
May-2006
Publisher
IOP Publishing Ltd
Keywords
CMP; shallow trench isolation; ceria; oxide film; nitride film; surfactant concentration; non-Prestonian
Citation
Japanese Journal of Applied Physics, v.45, no.5A, pp 3896 - 3904
Pages
9
Indexed
SCIE
SCOPUS
Journal Title
Japanese Journal of Applied Physics
Volume
45
Number
5A
Start Page
3896
End Page
3904
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/181503
DOI
10.1143/JJAP.45.3896
ISSN
0021-4922
1347-4065
Abstract
The dependencies of the non-Prestonian behavior of ceria slurry with anionic surfactant on the size and concentration of abrasive particles were investigated by performing chemical mechanical polishing (CMP) experiments using blanket wafers. We found that not only the abrasive size but also the abrasive concentration with s.urfactant addition influences the non-Prestonian behavior. Such behavior is clearly exhibited with small abrasive sizes and a higher concentrations of abrasives with surfactant addition, because the abrasive particles can locally contact the film surface more effectively with applied pressure. We introduce a factor to quantify these relations with the non-Prestonian behavior of a slurry. For ceria slurry, this non-Prestonian factor, beta(NP), was determined to be almost independent of the abrasive concentration for a larger size and a smaller weight conentration of abrasive particles, but it increased with the surfactant concentration for a smaller size and a higher concentration of abrasives with surfactant addition.
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서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
서울 공과대학 > 서울 에너지공학과 > 1. Journal Articles

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