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Effect of the hydroxyl-ethyl-cellulose concentration in a silicon wafer polishing slurry on the wafer surface roughness
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Cho, Kyu-Chul | - |
| dc.contributor.author | Jeon, Hyeongtag | - |
| dc.contributor.author | Park, Jea-Gun | - |
| dc.date.accessioned | 2022-12-21T11:44:52Z | - |
| dc.date.available | 2022-12-21T11:44:52Z | - |
| dc.date.issued | 2006-04 | - |
| dc.identifier.issn | 0374-4884 | - |
| dc.identifier.issn | 1976-8524 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/181621 | - |
| dc.description.abstract | The purpose of this study was to reveal the mechanism of wafer touch polishing using a high-purity colloidal silica slurry containing organic surfactants such as hydroxyl-ethyl cellulose. The effect of the surfactant concentration on wafer touch polishing was studied to improve the roughness of wafer surfaces after polishing. The haze level and the micro-roughness decreased with decreasing surfactant concentration. | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | 한국물리학회 | - |
| dc.title | Effect of the hydroxyl-ethyl-cellulose concentration in a silicon wafer polishing slurry on the wafer surface roughness | - |
| dc.type | Article | - |
| dc.publisher.location | 대한민국 | - |
| dc.identifier.scopusid | 2-s2.0-33646395136 | - |
| dc.identifier.wosid | 000236863300001 | - |
| dc.identifier.bibliographicCitation | Journal of the Korean Physical Society, v.48, no.4, pp L507 - L509 | - |
| dc.citation.title | Journal of the Korean Physical Society | - |
| dc.citation.volume | 48 | - |
| dc.citation.number | 4 | - |
| dc.citation.startPage | L507 | - |
| dc.citation.endPage | L509 | - |
| dc.type.docType | Article | - |
| dc.identifier.kciid | ART001006397 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Physics, Multidisciplinary | - |
| dc.subject.keywordPlus | NANO-CERIA SLURRY | - |
| dc.subject.keywordAuthor | wafer polishing | - |
| dc.subject.keywordAuthor | non-ionic surfactant | - |
| dc.subject.keywordAuthor | HEC | - |
| dc.subject.keywordAuthor | haze | - |
| dc.subject.keywordAuthor | roughness | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
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