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Atomic layer deposition of MoNx thin films using a newly synthesized liquid Mo precursor
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Byunguk | - |
| dc.contributor.author | Lee, Sangmin | - |
| dc.contributor.author | Kang, Taesung | - |
| dc.contributor.author | Kim, Sunghoon | - |
| dc.contributor.author | Koo, Sangman | - |
| dc.contributor.author | Jeon, Hyeongtag | - |
| dc.date.accessioned | 2023-01-25T09:10:31Z | - |
| dc.date.available | 2023-01-25T09:10:31Z | - |
| dc.date.created | 2023-01-05 | - |
| dc.date.issued | 2022-12 | - |
| dc.identifier.issn | 0734-2101 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/182125 | - |
| dc.description.abstract | Molybdenum nitride thin films are deposited using a newly synthesized liquid Mo precursor [MoCl4(THD)(THF)] in an ALD super-cycle process. The new precursor is synthesized using MoCl5 and 2,2,6,6-tetramethyl-3,5-heptanedione, which is a bidentate ligand. The synthesized precursor exists in the liquid phase at room temperature and has a characteristic of evaporating 99% at 150-220 ?. Using this new precursor in an ALD super-cycle process results in a pure MoNx thin film with few impurities (C and O). In addition, such MoNx thin films have relatively low resistivity values due to excellent crystallinity and a low impurity concentration. The films' diffusion barrier characteristics confirm that they can perform the role of a barrier at over 600℃. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | A V S AMER INST PHYSICS | - |
| dc.title | Atomic layer deposition of MoNx thin films using a newly synthesized liquid Mo precursor | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Koo, Sangman | - |
| dc.contributor.affiliatedAuthor | Jeon, Hyeongtag | - |
| dc.identifier.doi | 10.1116/6.0002154 | - |
| dc.identifier.scopusid | 2-s2.0-85144333153 | - |
| dc.identifier.wosid | 000885381900002 | - |
| dc.identifier.bibliographicCitation | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, v.40, no.6, pp.1 - 10 | - |
| dc.relation.isPartOf | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | - |
| dc.citation.title | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | - |
| dc.citation.volume | 40 | - |
| dc.citation.number | 6 | - |
| dc.citation.startPage | 1 | - |
| dc.citation.endPage | 10 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | CHEMICAL-VAPOR-DEPOSITION | - |
| dc.subject.keywordPlus | DIFFUSION BARRIER | - |
| dc.subject.keywordPlus | MO(CO)(6) | - |
| dc.subject.keywordPlus | TITANIUM | - |
| dc.subject.keywordPlus | PLASMA | - |
| dc.subject.keywordPlus | NH3 | - |
| dc.identifier.url | https://avs.scitation.org/doi/10.1116/6.0002154 | - |
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