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Development of a material mixing method for topology optimization of a structure with multiple thermal criteria

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dc.contributor.authorHan, S.Y.-
dc.contributor.authorKim, M.S.-
dc.contributor.authorChoi, S.H.-
dc.contributor.authorPark, J.Y.-
dc.contributor.authorYi, B.J.-
dc.date.accessioned2023-04-03T12:32:57Z-
dc.date.available2023-04-03T12:32:57Z-
dc.date.created2022-09-16-
dc.date.issued2007-09-
dc.identifier.issn1013-9826-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/182564-
dc.description.abstractA material mixing method to obtain an optimal topology for a structure in a thermal environment was suggested. This method is based on Evolutionary Structural Optimization (ESO). The proposed material mixing method extends the ESO method to a mixing several materials for a structure in the multicriteria optimization of thermal flux and thermal stress. To do this, the multiobjective optimization technique was implemented. The overall efficiency of material usage was measured in terms of the combination of thermal stress levels and heat flux densities by using a combination strategy with weighting factors. Optimal topologies having multiple thermal criteria for a printed circuit board (PCB) substrate were presented to illustrate validity of the suggested material mixing method. It was found that the suggested method works very well for the multicriteria topology optimization.-
dc.language영어-
dc.language.isoen-
dc.publisherTrans Tech Publications Ltd.-
dc.titleDevelopment of a material mixing method for topology optimization of a structure with multiple thermal criteria-
dc.typeArticle-
dc.contributor.affiliatedAuthorHan, S.Y.-
dc.contributor.affiliatedAuthorYi, B.J.-
dc.identifier.doi10.4028/0-87849-456-1.2832-
dc.identifier.scopusid2-s2.0-36049023085-
dc.identifier.wosid000252246301328-
dc.identifier.bibliographicCitationKey Engineering Materials, v.353-358, no.PART 4, pp.2832 - 2835-
dc.relation.isPartOfKey Engineering Materials-
dc.citation.titleKey Engineering Materials-
dc.citation.volume353-358-
dc.citation.numberPART 4-
dc.citation.startPage2832-
dc.citation.endPage2835-
dc.type.rimsART-
dc.type.docTypeConference Paper-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusEvolutionary algorithms-
dc.subject.keywordPlusMaterials handling-
dc.subject.keywordPlusPrinted circuit boards-
dc.subject.keywordPlusThermal effects-
dc.subject.keywordPlusMaterial mixing method-
dc.subject.keywordPlusMultiple thermal criteria-
dc.subject.keywordPlusPCB substrate-
dc.subject.keywordPlusShape optimization-
dc.subject.keywordAuthorMaterial mixing method-
dc.subject.keywordAuthorMultiple thermal criteria-
dc.subject.keywordAuthorPCB substrate-
dc.subject.keywordAuthorTopology optimization-
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