Development of a material mixing method for topology optimization of a structure with multiple thermal criteria
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Han, S.Y. | - |
dc.contributor.author | Kim, M.S. | - |
dc.contributor.author | Choi, S.H. | - |
dc.contributor.author | Park, J.Y. | - |
dc.contributor.author | Yi, B.J. | - |
dc.date.accessioned | 2023-04-03T12:32:57Z | - |
dc.date.available | 2023-04-03T12:32:57Z | - |
dc.date.created | 2022-09-16 | - |
dc.date.issued | 2007-09 | - |
dc.identifier.issn | 1013-9826 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/182564 | - |
dc.description.abstract | A material mixing method to obtain an optimal topology for a structure in a thermal environment was suggested. This method is based on Evolutionary Structural Optimization (ESO). The proposed material mixing method extends the ESO method to a mixing several materials for a structure in the multicriteria optimization of thermal flux and thermal stress. To do this, the multiobjective optimization technique was implemented. The overall efficiency of material usage was measured in terms of the combination of thermal stress levels and heat flux densities by using a combination strategy with weighting factors. Optimal topologies having multiple thermal criteria for a printed circuit board (PCB) substrate were presented to illustrate validity of the suggested material mixing method. It was found that the suggested method works very well for the multicriteria topology optimization. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Trans Tech Publications Ltd. | - |
dc.title | Development of a material mixing method for topology optimization of a structure with multiple thermal criteria | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Han, S.Y. | - |
dc.contributor.affiliatedAuthor | Yi, B.J. | - |
dc.identifier.doi | 10.4028/0-87849-456-1.2832 | - |
dc.identifier.scopusid | 2-s2.0-36049023085 | - |
dc.identifier.wosid | 000252246301328 | - |
dc.identifier.bibliographicCitation | Key Engineering Materials, v.353-358, no.PART 4, pp.2832 - 2835 | - |
dc.relation.isPartOf | Key Engineering Materials | - |
dc.citation.title | Key Engineering Materials | - |
dc.citation.volume | 353-358 | - |
dc.citation.number | PART 4 | - |
dc.citation.startPage | 2832 | - |
dc.citation.endPage | 2835 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | Evolutionary algorithms | - |
dc.subject.keywordPlus | Materials handling | - |
dc.subject.keywordPlus | Printed circuit boards | - |
dc.subject.keywordPlus | Thermal effects | - |
dc.subject.keywordPlus | Material mixing method | - |
dc.subject.keywordPlus | Multiple thermal criteria | - |
dc.subject.keywordPlus | PCB substrate | - |
dc.subject.keywordPlus | Shape optimization | - |
dc.subject.keywordAuthor | Material mixing method | - |
dc.subject.keywordAuthor | Multiple thermal criteria | - |
dc.subject.keywordAuthor | PCB substrate | - |
dc.subject.keywordAuthor | Topology optimization | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1365
COPYRIGHT © 2021 HANYANG UNIVERSITY.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.