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Enhancement of Mechanical Properties based on Deformable-Covalently Attachable IPNs for Foldable Electronics
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김도환 | - |
| dc.date.accessioned | 2023-04-03T16:19:57Z | - |
| dc.date.available | 2023-04-03T16:19:57Z | - |
| dc.date.issued | 2022-08-23 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/183184 | - |
| dc.title | Enhancement of Mechanical Properties based on Deformable-Covalently Attachable IPNs for Foldable Electronics | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The 22nd International Meeting on Information Display | - |
| dc.citation.conferencePlace | 부산 벡스코(BEXCO) | - |
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Collections - 서울 공과대학 > 서울 화학공학과 > 2. Conference Papers
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Related Researcher
- Kim, Do Hwan
- COLLEGE OF ENGINEERING (DEPARTMENT OF CHEMICAL ENGINEERING)