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Effect of the ceria particle size on SiO2 film polishing rate by adjusting synthesis molar ratio

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dc.contributor.author박재근-
dc.date.accessioned2023-04-03T20:47:33Z-
dc.date.available2023-04-03T20:47:33Z-
dc.date.issued2022-04-22-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/184694-
dc.titleEffect of the ceria particle size on SiO2 film polishing rate by adjusting synthesis molar ratio-
dc.typeConference-
dc.citation.conferenceName2022 한국 물리학회-
dc.citation.conferencePlaceOn-line-
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서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers

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