Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Green and Facile Synthesis of Hybrid Composites with Ultralow Dielectric Properties from Water-Soluble Polyimide and Dual-Porous Silica Nanoparticles

Authors
Kim, SunkyuLee, YeongjePark, JongminSo, YujinJung, Hee-TaeKo, Min JaeWon, Jong ChanJeong, SunhoKim, Yun Ho
Issue Date
Jan-2023
Publisher
AMER CHEMICAL SOC
Keywords
polyimide; dual-porous; silica; composite; low dielectric
Citation
ACS APPLIED MATERIAL&INTERFACES, v.15, no.3, pp.4408 - 4418
Indexed
SCIE
SCOPUS
Journal Title
ACS APPLIED MATERIAL&INTERFACES
Volume
15
Number
3
Start Page
4408
End Page
4418
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/185120
DOI
10.1021/acsami.2c16197
ISSN
1944-8244
Abstract
Here, we proposed an eco-friendly synthetic method for synthesizing hybrid composites with ultralow dielectric properties at high frequencies up to 28 GHz for true 5G communication from aqueous aromatic polyimide (PI) polymers and dual-porous silica nanoparticles (DPS). The one-stepwater-based emulsion template method was used to synthesize the macroporous silica nanoparticles (MPS). A substantially negative ζ potential was produced along the surface of MPS by the poly(vinylpyrrolidone)-based chemical functionalization, enabling excellent aqueous dispersion stability. The water-soluble poly(amic acid) (PAA), as a precursor to PI, was also one-steppolymerized in an aqueous solution. The MPS were dispersed in a water-soluble PAA matrix to create the hybrid composite films using an entirely water-based approach. The compatibility between the PAA matrix and MPS was elucidated by investigating relatively diverse end-terminated PAAs (with either amine or carboxyl group). It was also discovered that, during a thermally activated imidization reaction, the MPS are in situ converted into the DPS with macro- and microporous structures (with a surface area of 1522.4 m2/g). The thermal, dielectric, mechanical, and morphological characteristics of each composite film were examined, while the amount of DPS in the PI matrix varied from 1 to 20 wt %. With the addition of 5 wt % DPS as an optimum condition, it showed ultralow dielectric properties, with the Dk and Df being 1.615 and 0.003 at a frequency of 28 GHz, respectively, and compatible mechanical properties, with the tensile strength and elastic modulus being 78.2 MPa and 0.32 GPa, respectively. These results can comprehensively satisfy various physical properties required as a substrate material for 5G communication devices.
Files in This Item
Go to Link
Appears in
Collections
서울 공과대학 > 서울 화학공학과 > 1. Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher Ko, Min Jae photo

Ko, Min Jae
COLLEGE OF ENGINEERING (DEPARTMENT OF CHEMICAL ENGINEERING)
Read more

Altmetrics

Total Views & Downloads

BROWSE