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An Integrated Simulation Tool for Computer Architecture and Cyber-Physical Systems

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dc.contributor.authorKim, Hokeun-
dc.contributor.authorWasicek, Armin-
dc.contributor.authorLee, Edward A.-
dc.date.accessioned2023-08-22T03:20:45Z-
dc.date.available2023-08-22T03:20:45Z-
dc.date.created2023-07-10-
dc.date.issued2019-04-
dc.identifier.issn0302-9743-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/189558-
dc.description.abstractSimulating computer architecture as a cyber-physical system has many potential use cases including simulation of side channels and software-in-the-loop modeling and simulation. This paper presents an integrated simulation tool using a computer architecture simulator, gem5 and Ptolemy II. As a case study of this tool, we build a power and thermal model for a DRAM using the proposed tool integration approach where architectural aspects are modeled in gem5 and physical aspects are modeled in Ptolemy II. We also demonstrate simulation results of power and temperature of a DRAM with software benchmarks.-
dc.language영어-
dc.language.isoen-
dc.publisherSpringer Verlag-
dc.titleAn Integrated Simulation Tool for Computer Architecture and Cyber-Physical Systems-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Hokeun-
dc.identifier.doi10.1007/978-3-030-17910-6_7-
dc.identifier.scopusid2-s2.0-85065046138-
dc.identifier.bibliographicCitationLecture Notes in Computer Science, pp.83 - 93-
dc.relation.isPartOfLecture Notes in Computer Science-
dc.citation.titleLecture Notes in Computer Science-
dc.citation.startPage83-
dc.citation.endPage93-
dc.type.rimsART-
dc.type.docType정기학술지(Article(Perspective Article포함))-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordPlusComputer software-
dc.subject.keywordPlusCyber Physical System-
dc.subject.keywordPlusEmbedded systems-
dc.subject.keywordPlusArchitectural simulation-
dc.subject.keywordPlusComputer architecture simulators-
dc.subject.keywordPlusIntegrated simulations-
dc.subject.keywordPlusPhysical aspects-
dc.subject.keywordPlusSide-channel-
dc.subject.keywordPlusSoftware in the loops-
dc.subject.keywordPlusThermal model-
dc.subject.keywordPlusTool integration-
dc.subject.keywordAuthorArchitectural simulation-
dc.subject.keywordAuthorCyber-physical systems-
dc.subject.keywordAuthorDRAM thermal modeling-
dc.subject.keywordAuthorTool integration-
dc.identifier.urlhttps://link.springer.com/chapter/10.1007/978-3-030-17910-6_7-
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