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고정밀 반도체 패키징을 위한 공정장비 PHM의 필요성 및 계측 기술
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 소홍윤 | - |
| dc.date.accessioned | 2024-12-05T13:30:42Z | - |
| dc.date.available | 2024-12-05T13:30:42Z | - |
| dc.date.issued | 2023-07-05 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/200914 | - |
| dc.title | 고정밀 반도체 패키징을 위한 공정장비 PHM의 필요성 및 계측 기술 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 한국 PHM학회 2023년도 정기학술대회 | - |
| dc.citation.conferencePlace | 더케이호텔서울 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)