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Investigation of adhesion at LPCVD and PECVD silicon nitride/copper film interface by laser spallation technique
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이승환 | - |
| dc.date.accessioned | 2024-12-05T21:00:19Z | - |
| dc.date.available | 2024-12-05T21:00:19Z | - |
| dc.date.issued | 2024-06-27 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/201465 | - |
| dc.title | Investigation of adhesion at LPCVD and PECVD silicon nitride/copper film interface by laser spallation technique | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 대한기계학회 재료 및 파괴부문 2024년 춘계학술대회 | - |
| dc.citation.conferencePlace | 제주 서귀포 KAL호텔 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)