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레이저 파쇄 기술을 이용한 박막 계면 물성 측정
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이승환 | - |
| dc.date.accessioned | 2024-12-05T21:00:21Z | - |
| dc.date.available | 2024-12-05T21:00:21Z | - |
| dc.date.issued | 2024-04-03 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/201480 | - |
| dc.title | 레이저 파쇄 기술을 이용한 박막 계면 물성 측정 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 2024년 (사)한국마이크로전자 및 패키징학회(KMEPS) 정기학술대회 | - |
| dc.citation.conferencePlace | 국립아시아문화전당 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)