Effect of permanganate treatment on through mold vias for an embedded wafer level package

Abstract

In this study, a through mold via (TMV) interconnect was developed for an embedded wafer level package (EMWLP) to enable 3D packing applications. The effects of the shape and surface roughness of the epoxy molding wafer on the quality of electroless Cu metallization were investigated for the vertical interconnection. The mold compound is a composite material composed of epoxy resin and filler particles. Therefore, the effect of the amount of filler particles was studied to optimize the shape of the epoxy molding by applying two types of laser drilling modes. In addition, the electroless Cu plating process was optimized to deposit a Cu seed layer along the TMV sidewall. To optimize the TMV process, a desmear process was applied to improve the shape of the TMV sidewall and adhesion between the epoxy molding compound and the dielectric polymer for multilayer metallization.