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Fabrication of copper nanoparticles in 6FDA-ODA polyimide film

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dc.contributor.authorChoi, Dong Joo-
dc.contributor.authorAhnn, Key-one-
dc.contributor.authorChoi, Min Young-
dc.contributor.authorKim, Young Ho-
dc.date.accessioned2024-12-20T06:30:06Z-
dc.date.available2024-12-20T06:30:06Z-
dc.date.issued2012-02-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/202922-
dc.description.abstractWe investigate the formation of Cu nanoparticles in a polyimide (PI) film. The Cu nanoparticles were uniformly dispersed in the PI film by curing a precursor of PI, polyamic acid (PAA) containing Cu ions. The PAA was imidized to PI at 350°C for 2 hours in forming gas (5% H 2+95% N 2), accompanying the nanoparticle precipitation. X-ray diffracton patterns revealed that Cu nanoparticles formed by curing in a reducing atmosphere, and transmission electron microscopy showed that about 5 nm sized Cu nanoparticles were dispersed in the PI film.-
dc.format.extent1-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEE-
dc.titleFabrication of copper nanoparticles in 6FDA-ODA polyimide film-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/NMDC.2011.6155281-
dc.identifier.scopusid2-s2.0-84860498216-
dc.identifier.bibliographicCitation2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011, pp 517 - 517-
dc.citation.title2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011-
dc.citation.startPage517-
dc.citation.endPage517-
dc.type.docTypeConference Paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordPlusCopper nanoparticles-
dc.subject.keywordPlusCu ions-
dc.subject.keywordPlusCu nanoparticles-
dc.subject.keywordPlusForming gas-
dc.subject.keywordPlusNanoparticle precipitation-
dc.subject.keywordPlusPI film-
dc.subject.keywordPlusPolyamic acids-
dc.subject.keywordPlusPolyimide film-
dc.subject.keywordPlusReducing atmosphere-
dc.subject.keywordPlusCuring-
dc.subject.keywordPlusNanoparticles-
dc.subject.keywordPlusNanotechnology-
dc.subject.keywordPlusPolyimides-
dc.subject.keywordPlusPolymeric films-
dc.subject.keywordPlusTransmission electron microscopy-
dc.subject.keywordPlusCopper-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/6155281/-
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