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전사 인쇄를 활용한 다종의 박막 반도체 이종 집적 3D IC 기술
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 정예환 | - |
| dc.date.accessioned | 2025-01-10T01:00:35Z | - |
| dc.date.available | 2025-01-10T01:00:35Z | - |
| dc.date.issued | 2024-04-03 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/205932 | - |
| dc.title | 전사 인쇄를 활용한 다종의 박막 반도체 이종 집적 3D IC 기술 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | KMEPS 2024년 정기학술대회 | - |
| dc.citation.conferencePlace | 국립아립 | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Jung, Yei Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)