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Modeling of Chiplet-based 2.5D Packaging with Silicon Bridge
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 임재명 | - |
| dc.date.accessioned | 2025-01-17T02:30:26Z | - |
| dc.date.available | 2025-01-17T02:30:26Z | - |
| dc.date.issued | 2024-08-22 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/206203 | - |
| dc.title | Modeling of Chiplet-based 2.5D Packaging with Silicon Bridge | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | International SoC Design Conference | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Lim, Jaemyung
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)