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Laser spallation test for quantifying the interfacial adhesion between copper and silicon nitride thin films deposited by low-pressure chemical vapor deposition and plasma-enhanced chemical vapor deposition process
- Authors
- 이승환
- Issue Date
- 25-Apr-2025
- Place
- Arcrea HIMEJI
- Conference Name
- ICMDT2025
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)