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Laser Spallation Test를 활용한 LPCVD 및 PECVD로 증착된 Silicon Nitride와 Copper 박막간 계면 접착 강도 평가
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이승환 | - |
| dc.date.accessioned | 2025-06-19T20:00:16Z | - |
| dc.date.available | 2025-06-19T20:00:16Z | - |
| dc.date.issued | 2025-05-14 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/207740 | - |
| dc.title | Laser Spallation Test를 활용한 LPCVD 및 PECVD로 증착된 Silicon Nitride와 Copper 박막간 계면 접착 강도 평가 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 2025 한국정밀공학회 춘계학술대회 | - |
| dc.citation.conferencePlace | 제주 신화월드 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)