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Ferroelectric Memcapacitor Crossbar Array with NAND Flash Structure for In-Memory Computing
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hwang, Hwiho | - |
| dc.contributor.author | Yu, Junsu | - |
| dc.contributor.author | Youn, Sangwook | - |
| dc.contributor.author | Kim, Hyungjin | - |
| dc.date.accessioned | 2026-04-21T04:30:16Z | - |
| dc.date.available | 2026-04-21T04:30:16Z | - |
| dc.date.issued | 2026-01 | - |
| dc.identifier.issn | 0163-1918 | - |
| dc.identifier.issn | 2156-017X | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/212271 | - |
| dc.description.abstract | In this paper, 48×24 ferroelectric memcapacitor crossbar is experimentally demonstrated based on NAND flash structure, with TiN/HZO/SiO2/poly-Si gate stack. With the optimal read voltage, a wide charge memory window of ~12.27 fC/μm2 is achieved. Read, write, and inhibit operations are successfully verified across the fabricated array, enabling reliable 4-bit multilevel programming with retention over 10 years. Vector-matrix multiplication operations are confirmed with an R2 value of 0.984, with the verification of output sensing circuit. Also, CIFAR-10 classification is implemented on the fabricated 48×24 array by pretrained weight transfer with 4-bit device states, achieving accuracy of 87.75%. The feasibility of vertically stacked structure based on 3D-NAND flash is also verified by TCAD and SPICE simulations. | - |
| dc.format.extent | 4 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.title | Ferroelectric Memcapacitor Crossbar Array with NAND Flash Structure for In-Memory Computing | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/IEDM50572.2025.11353797 | - |
| dc.identifier.scopusid | 2-s2.0-105033519389 | - |
| dc.identifier.wosid | 001701480300223 | - |
| dc.identifier.bibliographicCitation | 2025 IEEE International Electron Devices Meeting (IEDM), pp 1 - 4 | - |
| dc.citation.title | 2025 IEEE International Electron Devices Meeting (IEDM) | - |
| dc.citation.startPage | 1 | - |
| dc.citation.endPage | 4 | - |
| dc.type.docType | Conference paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Computer Science | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Computer Science, Hardware & Architecture | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & ElectronicPhysics, Applied | - |
| dc.subject.keywordPlus | Ferroelectricity | - |
| dc.subject.keywordPlus | Flash memory | - |
| dc.subject.keywordPlus | Matrix algebra | - |
| dc.subject.keywordPlus | Memory architecture | - |
| dc.subject.keywordPlus | SPICE | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/11353797 | - |
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