Lumped Model of TGVs Using a Transmission Line Approach with Pitch Variation

Abstract

As the demand for high bandwidth and high-speed interconnects continues to grow, 2.5D integration using glass interposers has emerged as a promising solution. A critical component in these systems is the Through-glass via (TGV), which provides vertical signal routing across the substrate. To facilitate rapid electrical characterization, this paper presents a compact lumped model for TGVs based on a two-transmission-line representation. The proposed model accounts for the pitch between signal and ground TGVs in a signal-ground-signal configuration. Its accuracy is evaluated by comparing the S-parameters (S11, S21, and S41) with full-wave HFSS simulation results.