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유체 투과성을 가진 다공성 웨어러블 패치 제작 공정
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김동립 | - |
| dc.date.accessioned | 2026-06-24T11:02:30Z | - |
| dc.date.available | 2026-06-24T11:02:30Z | - |
| dc.date.issued | 2025-03-27 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/215147 | - |
| dc.title | 유체 투과성을 가진 다공성 웨어러블 패치 제작 공정 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 2025 마이크로나노시스템학회 춘계학술대회 | - |
| dc.citation.conferencePlace | 제주 국제컨벤션 센터(ICC) | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Dong Rip
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)