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Transient thermal analysis of multi-layer RDL for 2.1D package
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김동립 | - |
| dc.date.accessioned | 2026-06-24T11:03:08Z | - |
| dc.date.available | 2026-06-24T11:03:08Z | - |
| dc.date.issued | 2024-11-08 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/215162 | - |
| dc.title | Transient thermal analysis of multi-layer RDL for 2.1D package | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | ISMP 2024 (The 22nd International Symposium on Microelectronics and Packaging) | - |
| dc.citation.conferencePlace | 부산 파라다이스 호텔 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Dong Rip
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)