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Defect mitigation in the electroplating process for micro-scale copper structures
- Authors
- 소홍윤
- Issue Date
- 11-Dec-2024
- Place
- Rmada Plaza, Jeju, South Korea
- Conference Name
- The 2nd International Symposium on Micro & Nano Manufacturing
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)