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Hybrid Bonding용 Dishing 저감을 위한 Cu/Oxide Multi-Step CMP
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김민구 | - |
| dc.date.accessioned | 2026-06-25T14:35:26Z | - |
| dc.date.available | 2026-06-25T14:35:26Z | - |
| dc.date.issued | 2026-04-02 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/216873 | - |
| dc.title | Hybrid Bonding용 Dishing 저감을 위한 Cu/Oxide Multi-Step CMP | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 2026년 정기학술대회 | - |
| dc.citation.conferencePlace | 송도컨벤시아 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Min Ku
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)