Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Thermal Impact of TSV Misalignment and Micro- Bump Height in 3D IC Packages
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 임재명 | - |
| dc.date.accessioned | 2026-06-25T14:37:09Z | - |
| dc.date.available | 2026-06-25T14:37:09Z | - |
| dc.date.issued | 2025-10-17 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/216902 | - |
| dc.title | Thermal Impact of TSV Misalignment and Micro- Bump Height in 3D IC Packages | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | ISOCC(International SoC Design Conference) | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Lim, Jaemyung
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)