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Simulation Setup Impact of TSV Misalignment on Thermal Performance in 3D IC Packages
- Authors
- 임재명
- Issue Date
- 2-Apr-2025
- Conference Name
- THE KOREAN MICROELECTRONICS AND PACKAGING SOCIETY 정기 학술대회
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Lim, Jaemyung
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)