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이종 접합 계면에서의 다중 스케일 열 모델링
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박우성 | - |
| dc.date.accessioned | 2026-06-25T17:05:17Z | - |
| dc.date.available | 2026-06-25T17:05:17Z | - |
| dc.date.issued | 2024-11-07 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/217324 | - |
| dc.title | 이종 접합 계면에서의 다중 스케일 열 모델링 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | International Symposium on Microelectronics and Packaging | - |
| dc.citation.conferencePlace | 부산 파라다이스 호텔 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Park, Woosung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)