Design and Implementation of High-Speed Interfaces with TGV for 2.5D/3D Glass Interposer

Abstract

With the rapid growth of ultra-large AI systems, 2.5D/3D packaging technologies have gained attention to overcome traditional integration limitations. Among interposer materials, glass is a strong candidate due to low signal loss, dimensional stability, and process compatibility. This paper presents the design and signal integrity (SI) analysis of high-speed interconnects in 2.5D/3D glass interposer-based packages. Transmission line structures with multiple signal-to-ground configurations are explored to support 32 Gbps data rates. We analyzed insertion loss (IL), eye diagram characteristics, and crosstalk through 3D electromagnetic (EM) simulation across routing schemes. The frequency-domain Voltage Transfer Function (VTF) is used as the primary SI metric to reflect unterminated signaling typically seen in advanced packaging. Results confirm that the proposed multi-ground guiding structure achieves low IL, reduced crosstalk, clear eye openings. All configurations meet the transmission specifications presented in the UCIe standard for VTF and high-speed channel SI performance.