Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Oh, Yoong | - |
dc.contributor.author | Kim, Eun Jeong | - |
dc.contributor.author | Kim, Yongdeok | - |
dc.contributor.author | Choi, Kwangseok | - |
dc.contributor.author | Han, Won Bae | - |
dc.contributor.author | Kim, Hee-Soo | - |
dc.contributor.author | Yoon, Chong Seung | - |
dc.date.accessioned | 2021-08-02T17:31:01Z | - |
dc.date.available | 2021-08-02T17:31:01Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2016-02 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/23987 | - |
dc.description.abstract | The effect of Ar plasma pretreatment on the adhesion of the sputter-deposited Cu/Ti film, which was used as a seed layer for subsequent electrodeposition of thick Cu film, on an Ajinomoto build-up film (ABF) was evaluated as a function of the plasma power. The Ar plasma pretreatment of the ABF (above 1.2 kW) surface resulted in three-fold increase of the peel-off strength (0.70 kN/m) compared to the untreated sample (0.23 kN/m). The Ar plasma treatment produced a nanoscale worm-like surface roughness on the ABF surface which was responsible for the improved adhesion of the Cu/Ti film. Examination of the fractured surfaces revealed that when the substrate was plasma-treated above 1.2 kW, the fracture occurred in the substrate rather than by delamination of the Cu/Ti film. In fact, the fracture of the ABF substrate, which consists of the SiO₂ filler embedded in a polymer resin matrix, proceeded mainly by decohesion of the SiO₂ microspheres from the polymer matrix. Hence, to further improve the adhesion of the Cu/Ti film, it is advisable to consider strengthening the interface between the SiO₂ filler and the resin matrix through surface modification of the SiO₂ microspheres. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.title | Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Yoon, Chong Seung | - |
dc.identifier.doi | 10.1016/j.tsf.2016.01.010 | - |
dc.identifier.scopusid | 2-s2.0-84958611379 | - |
dc.identifier.wosid | 000371043400015 | - |
dc.identifier.bibliographicCitation | THIN SOLID FILMS, v.600, no.2, pp.90 - 97 | - |
dc.relation.isPartOf | THIN SOLID FILMS | - |
dc.citation.title | THIN SOLID FILMS | - |
dc.citation.volume | 600 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 90 | - |
dc.citation.endPage | 97 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | WETTABILITY | - |
dc.subject.keywordPlus | POLYIMIDE | - |
dc.subject.keywordPlus | SURFACES | - |
dc.subject.keywordAuthor | ABF | - |
dc.subject.keywordAuthor | Adhesion strength | - |
dc.subject.keywordAuthor | Peel-off testing | - |
dc.identifier.url | This work was supported by the World-Class 300 Project (World Class 300 Project No: 10046975, the development of μ-sec rapid head treatment system for next-generation display and printed electronic components) funded by the Small and Medium Business Administration of Korea (SMBA). | - |
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