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3-D synthetic imaging using 128-channel 2-D sparse capacitive micromachined ultrasonic transducer array
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Choi, Won Young | - |
| dc.contributor.author | Kwak, Yun Sang | - |
| dc.contributor.author | Park, Kwan Kyu | - |
| dc.date.accessioned | 2021-07-30T04:58:32Z | - |
| dc.date.available | 2021-07-30T04:58:32Z | - |
| dc.date.issued | 2017-10 | - |
| dc.identifier.issn | 1948-5719 | - |
| dc.identifier.issn | 1948-5727 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/2462 | - |
| dc.description.abstract | A 2-D array is essential for the construction of a 3-D image. Previous researches have demonstrated how a 3-D ultrasonic image can be constructed by mechanically translating and rotating a 1-D array. For non-mechanical imaging, 2-D dense arrays have been investigated; however, they pose a challenge in practical implementation due to a large number of interconnections. To overcome this problem, we theoretically study a 2-D sparse array with a small number of channels located in a component of the array. | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.title | 3-D synthetic imaging using 128-channel 2-D sparse capacitive micromachined ultrasonic transducer array | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/ULTSYM.2017.8092786 | - |
| dc.identifier.scopusid | 2-s2.0-85039448333 | - |
| dc.identifier.bibliographicCitation | IEEE International Ultrasonics Symposium, IUS | - |
| dc.citation.title | IEEE International Ultrasonics Symposium, IUS | - |
| dc.type.docType | Conference Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.subject.keywordPlus | Imaging | - |
| dc.subject.keywordPlus | Ultrasonic transducer arrays | - |
| dc.subject.keywordPlus | Control systems | - |
| dc.subject.keywordPlus | Ultrasonic transducers | - |
| dc.subject.keywordPlus | Mechanical engineering | - |
| dc.subject.keywordPlus | Silicon | - |
| dc.subject.keywordPlus | Ultrasonic imaging | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8092786 | - |
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