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An effective measurement method of electromagnetic shielding for 3D package application
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-02T18:00:42Z | - |
| dc.date.available | 2021-08-02T18:00:42Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2018-10-24 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/25347 | - |
| dc.publisher | Institute of Electrical and Electronics Engineers: Electronics Packaging Society - Taipei | - |
| dc.title | An effective measurement method of electromagnetic shielding for 3D package application | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | 2018 International Microsystems, Packaging, Assembly and Circuits Technology Conference | - |
| dc.relation.isPartOf | 2018 International Microsystems, Packaging, Assembly and Circuits Technology Conference | - |
| dc.citation.title | 2018 International Microsystems, Packaging, Assembly and Circuits Technology Conference | - |
| dc.citation.conferencePlace | Taipei Nangang Exhibition Center, Taiwan | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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