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An Advanced Fan-out Package Utilizing Backside Metallization and Solder Self-alignment
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-02T19:55:16Z | - |
| dc.date.available | 2021-08-02T19:55:16Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2018-06-21 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/28309 | - |
| dc.publisher | Center for Advanced Aerospace Materials, POSTECH | - |
| dc.title | An Advanced Fan-out Package Utilizing Backside Metallization and Solder Self-alignment | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | 10 th Korea-Japan Berkeley Symposium on Advanced Materials | - |
| dc.relation.isPartOf | 10 th Korea-Japan Berkeley Symposium on Advanced Materials | - |
| dc.citation.title | 10 th Korea-Japan Berkeley Symposium on Advanced Materials | - |
| dc.citation.conferencePlace | Rm 107, Graduate Institute of Ferrous Technology, POSTECH | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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