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Effect of Wafer Thickness and Damage Layet Thickness on Residual Stress and Bow of Free-standing Gallium Nitride Wafers
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박재근 | - |
| dc.date.accessioned | 2021-08-02T22:27:56Z | - |
| dc.date.available | 2021-08-02T22:27:56Z | - |
| dc.date.issued | 2017-11-22 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/29997 | - |
| dc.title | Effect of Wafer Thickness and Damage Layet Thickness on Residual Stress and Bow of Free-standing Gallium Nitride Wafers | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 7th International Symposium for Advanced Functional Materials & Devices | - |
| dc.citation.conferencePlace | SUMCO Kyushu Factory (Imari) | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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