Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Effect of Filler Size Distribution on Coefficient of Thermal Expansion (CTE) of Non-Conductive Adhesive (NCA)
- Authors
- 김영호
- Issue Date
- 18-Oct-2017
- Publisher
- Korean Microelectronics and Packaging Society
- Citation
- 16th International Symposium on Microelectronics and Packaging 2017
- Conference Name
- 16th International Symposium on Microelectronics and Packaging 2017
- Place
- COEX, Seoul, Korea
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.