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Effect of Substrate and Damaged Layter Thickness to Residual Stress and Bow of Free-standing Gallium Nitride Wafers during Wafering Process
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박재근 | - |
| dc.date.accessioned | 2021-08-03T00:27:56Z | - |
| dc.date.available | 2021-08-03T00:27:56Z | - |
| dc.date.issued | 2017-10-03 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/31191 | - |
| dc.title | Effect of Substrate and Damaged Layter Thickness to Residual Stress and Bow of Free-standing Gallium Nitride Wafers during Wafering Process | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 232nd ECS Meeting | - |
| dc.citation.conferencePlace | Gaylord National Resort & Convention Center | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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