Thermo-compression flip-chip bonding technology using nonconductive adhesives for ultra-fine pitch applications
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2021-08-03T01:52:42Z | - |
dc.date.available | 2021-08-03T01:52:42Z | - |
dc.date.created | 2021-06-30 | - |
dc.date.issued | 2017-06-22 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/32054 | - |
dc.publisher | Berkeley Symposium Committee | - |
dc.title | Thermo-compression flip-chip bonding technology using nonconductive adhesives for ultra-fine pitch applications | - |
dc.type | Conference | - |
dc.contributor.affiliatedAuthor | 김영호 | - |
dc.identifier.bibliographicCitation | 9th Korea-Japan Berkeley Symposium on Advanced Materials | - |
dc.relation.isPartOf | 9th Korea-Japan Berkeley Symposium on Advanced Materials | - |
dc.citation.title | 9th Korea-Japan Berkeley Symposium on Advanced Materials | - |
dc.citation.conferencePlace | University of California, Berkeley | - |
dc.type.rims | CONF | - |
dc.description.journalClass | 1 | - |
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