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Growth Behavior of Interfacial Intermetallic Compound at ENIG and Sn-Ag-Cu Solder Joint with Plating Temperature of Ni(P)
- Authors
- 김영호
- Issue Date
- 1-Mar-2017
- Publisher
- The Minerals, Metals & Materials Society
- Citation
- 2017 TMS Annual Meeting & Exhibition
- Conference Name
- 2017 TMS Annual Meeting & Exhibition
- Place
- San Diego, California, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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