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Adhesion of nonconductive film onto SiO2 substrates after oxygen plasma treatment

Authors
김영호
Issue Date
25-Oct-2016
Publisher
The Korean Microelectronics and Packaging Society
Citation
The 15th International Symposium on Microelectronics and Packaging
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/34869
Conference Name
The 15th International Symposium on Microelectronics and Packaging
Place
COEX, Seoul, Korea
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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