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Highly Reliable Pb-free Solder Joints Fabricated Using CuZn Solder Wetting Layers
- Authors
- 김영호
- Issue Date
- 14-Apr-2016
- Publisher
- 한국마이크로전자 및 패키징 학회
- Citation
- 2016 춘계 정기학술대회
- Conference Name
- 2016 춘계 정기학술대회
- Place
- 성균관대학교 자연과학캠퍼스 제1종합연구동 81805호
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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