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The effect of solder wetting on nonconductive adhesive trapping in NCA applied flip-chip bonding
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T07:17:46Z | - |
| dc.date.available | 2021-08-03T07:17:46Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2015-10-15 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/39089 | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | The effect of solder wetting on nonconductive adhesive trapping in NCA applied flip-chip bonding | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.relation.isPartOf | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.citation.title | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.citation.conferencePlace | KINTEX, Seoul / Ilsan, Korea | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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