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Development of Chip-on-flex Bonding using Sn-based Bumps and Non-conductive Adhesive
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T08:33:37Z | - |
| dc.date.available | 2021-08-03T08:33:37Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2014-11-18 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/41862 | - |
| dc.publisher | KIM (The Korean Institute of Metals and Materials) | - |
| dc.title | Development of Chip-on-flex Bonding using Sn-based Bumps and Non-conductive Adhesive | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | International Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014) | - |
| dc.relation.isPartOf | International Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014) | - |
| dc.citation.title | International Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014) | - |
| dc.citation.conferencePlace | Jeju Island, Korea | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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