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Nano-Embossing Ceria Abrasive with Polishing Rate Accelerator for Scratch-Less Poly-Si Stop CMP Application
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박재근 | - |
| dc.date.accessioned | 2021-08-03T10:36:01Z | - |
| dc.date.available | 2021-08-03T10:36:01Z | - |
| dc.date.issued | 2014-02-26 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/45130 | - |
| dc.title | Nano-Embossing Ceria Abrasive with Polishing Rate Accelerator for Scratch-Less Poly-Si Stop CMP Application | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 제 21회 한국반도체학술대회 | - |
| dc.citation.conferencePlace | 한양대학교 | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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