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T/C Reliability of Current Assisted Cu-Cu Direct Bonding on the Contact Resistance
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T10:47:40Z | - |
| dc.date.available | 2021-08-03T10:47:40Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2014-02-18 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/45212 | - |
| dc.publisher | The Minerals, Metals & Materials Society (TMS) | - |
| dc.title | T/C Reliability of Current Assisted Cu-Cu Direct Bonding on the Contact Resistance | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | The Minerals, Metals & Materials Society 2014 (TMS 2014) | - |
| dc.relation.isPartOf | The Minerals, Metals & Materials Society 2014 (TMS 2014) | - |
| dc.citation.title | The Minerals, Metals & Materials Society 2014 (TMS 2014) | - |
| dc.citation.conferencePlace | San Diego, California, USA | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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